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$99
1.5TB
10 core
10-inch
10.1-inch
10.2-inch
10.5-inch
100GB
100w
1080p
10nm
11-inch
11.6-inch
11K
12-2.inch
12-inch
12.2-inch
12.5-inch
12.9-inch
128GB
128MB
12Gb
12MPx
13-inch
13.3-inch
14-inch
14nm
15-inch
15nm
16-nm
16GB
16nm
17-inch
18-inch
18.4-inch
180GB
18nm
19nm
1TB
2-in-1
2.1-inch
2.5-inch
20Gbps
20nm
21-inch
21.5-inch
22CV241
22nm
23-inch
23.8-inch
24-inch
24.1-inch
240GB
24MP76HM-S
2560 x 1080
256GB
27-inch
276E6ADS
28-inch
284E5QHAD
28nm
29-inch
29EA73-P
2GB
2K
2k games
3.5-inch
30-bit
30-inch
3200MHz
32GB
32nm
335 Series
34-inch
34nm
3840 x 2160
3d
3D NAND
3D Touch
3D Tri-gate
3D V-NAND
3dfxzone.it
3dmark
3g
3G HSPAplus
4-inch
4.7-inch
40nm
4g
4G LTE
4GB
4K
4k2k
4TB
5-inch
5.1-inch
5.2-inch
5.5-inch
5.7-inch
5120 x 2880 pixel
530
55-inch
5G
5K
5nm
6-inch
64-bit
6GB
6TB
7-inch
7-series
7.0-inch
7.85-inch
7.9-inch
7200RPM
7mm
7nm
8-inch
8.0-inch
8.4-inch
80 Plus Platinum
802.11ac
80GB
8400mAh
850 EVO
8Gb
9-series
9.7-inch
950 PRO
a-data
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A10
A10-7700K
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A15
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Android 6
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igzo
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Intrepid 3600
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ion
IOPS
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iOS 7
iOS 8
iOS 9
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Moorefield
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MX239HR
My Mobile. My Moment
mysql
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NEC Display Solutions of America
Need for Speed Most Wanted
Need for Speed No Limits
Need for Speed Rivals
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NenaMark2
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Network Function Virtualization
Network-Attached Storage
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Neutron Series GTX
new zealand
Next Unit of Computing
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Nexus 5
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Nexus One
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NFC
NFV
NGFF
NH-U12DX i4
NH-U9DX i4
NiC Series
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Nolan
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NTT docomo
NUBES
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nuova generazione
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Oculus
ocz
ODM
oel
oem
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Office 365 Home Premium
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Onda
ondata
One
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ooocrackz
open
open source
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Abbiamo pubblicato 6 documenti correlati con il tag HiSilicon
Pagina 1 di 1
TSMC fabbrica i modem 5G per numerosi clienti tra cui Qualcomm e HiSilicon Il maker taiwanese Taiwan Semiconductor Manufacturing Company (TSMC) si sta occupando della produzione dei chip con funzionalità di modem 5G per un ampio set di aziende che progettano tali sistemi ma non dispongono di impianti per la fabbricazione degli stessi.
Image courtesy of Endgaget
Più in dettaglio, TSMC ha già avviato la produzione... »
Huawei lavora sullo sviluppo di SoC per smartphone con modem 5G integrati Huawei e il chip maker HiSilicon, una azienda controllata dal gigante cinese della telefonia mobile, stanno spingendo sullo sviluppo di SoC per smartphone dotati di modem integrati compatibili con le reti 5G.
Finora Huawei ha proposto il SoC Kirin 985 come soluzione, il cui lancio commerciale è pianificato nella seconda parte del 2019, finalizzata... »
TSMC avvierà la produzione in volumi con il nodo a 7nm EUV nel secondo trimestre Il maker taiwanese Taiwan Semiconductor Manufacturing Company (TSMC) è pronto per partire con la produzione in volumi dei chip con il nodo a 7nm "enhanced", o anche "N7+", che prevede l'impiego della litografia di tipo EUV (Extreme Ultraviolet Lithography), nel corso del trimestre corrente.
Lo si apprende da un recente report, pubblicato... »
TSMC potrebbe anticipare la produzione in volumi con il nodo a 7nm Taiwan Semiconductor Manufacturing Company (TSMC) potrebbe accelerare l'inizio della produzione in volumi con il nodo a 7nm, anticipando sostanzialmente la pianificazione ufficiale, a seguito della elevata domanda relativa alla nuova realizzazione dei chip con la nuova tecnologia.
In accordo a fonti taiwanesi vicine al comparto della fabbricazione... »
Huawei prepara il lancio del Mate 10 per competere con i nuovi iPhone di Apple Huawei ha pianificato il lancio del suo prossimo smartphone flag-ship, denominato Mate 10, nel corso del prossimo autunno.
Più in dettaglio, in base a un report proveniente da fonti taiwanesi che operano nel comparto della produzione degli smartphone, Huawei conta di lanciare il Mate 10 simultaneamente, o quasi, all'arrivo dell'iPhone di nuova generazione.
Nelle... »
Si avvicina il lancio dello smartphone mid-range Honor 6X di Huawei Huawei ha fissato la data per il lancio del sul prossimo smartphone mid-range denominato Honor 6X. Lo si evince dall'invio di inviti per la conferenza stampa dedicata all'evento che il vendor cinese ha effettuato a favore di alcuni giornalisti.
Lo smartphone Honor 6X è basato su un SoC Kirin 650 prodotto da HiSilicon ed è equipaggiato con... »
